Polishing module HP2 for LaboStar until 2015

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Polishing module HP2 for low organic application
Consumables for all LaboStar® systems until April 2015


Selected carbon and electric grade resin material combined in one polishing module.
Module used to remove organic contaminants (especially low TOC-level) and to produce water at 0.055 µS/cm.
 
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WEEE obligation: no
WEEE registration number: DE 91825945